納米(mi)/亞微(wei)(wei)米(mi)球形硅微(wei)(wei)粉5G產業中(zhong)芯片載體（IC載板(ban)(ban)）和(he)高(gao)頻高(gao)速(su)(su)覆(fu)銅(tong)(tong)板(ban)(ban)的關鍵材(cai)料(liao)。IC 封裝(zhuang)載板(ban)(ban)用(yong)覆(fu)銅(tong)(tong)板(ban)(ban)（即 IC 載板(ban)(ban)）、射(she)頻/微(wei)(wei)波電路用(yong)覆(fu)銅(tong)(tong)板(ban)(ban)（即高(gao)頻覆(fu)銅(tong)(tong)板(ban)(ban)）以及高(gao)速(su)(su)數字電路用(yong)覆(fu)銅(tong)(tong)板(ban)(ban)（即高(gao)速(su)(su)覆(fu)銅(tong)(tong)板(ban)(ban)）三(san)大類特殊覆(fu)銅(tong)(tong)板(ban)(ban)，屬于(yu)生產制造過(guo)程技術難度和(he)下(xia)游應(ying)用(yong)領(ling)域性能要(yao)求較高(gao)的高(gao)端覆(fu)銅(tong)(tong)板(ban)(ban)板(ban)(ban)材(cai)。

覆銅(tong)板(ban)市場概(gai)況：高(gao)頻(pin)高(gao)速(su)和輕薄(bo)化(hua)為兩大技術發展趨(qu)勢(shi)；趨(qu)勢(shi)一：終(zhong)(zhong)端(duan)產(chan)品(pin)高(gao)頻(pin)高(gao)速(su)化(hua)，高(gao)速(su)覆銅(tong)板(ban)市場增長機會顯(xian)著；趨(qu)勢(shi)二：終(zhong)(zhong)端(duan)應用輕薄(bo)短小化(hua)，疊加 5G 手機普及加強(qiang) HDI 成長動能(neng)；SLP前景逐(zhu)漸明朗，IC載板(ban)供不應求。

（文字來源網絡）